Brian Mattis

Publication Activity (10 Years)

Years Active: 2008-2016
Publications (10 Years): 2

Top Topics

Top Venues

Publications

Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones
Front-side mid-level Tungsten TSV integration for high-density 3D applications. 3DIC (2016)
Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi
High density backside tungsten TSV for 3D stacked ICs. 3DIC (2016)
Vivek Subramanian, Josephine B. Chang, Alejandro de la Fuente Vornbrock, Daniel C. Huang, Lakshmi Jagannathan, Frank Liao, Brian Mattis, Steven E. Molesa, David R. Redinger, Daniel Soltman, Steven K. Volkman, Qintao Zhang
Printed electronics for low-cost electronic systems: Technology status and application development. ESSCIRC (2008)