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Front-side mid-level Tungsten TSV integration for high-density 3D applications.
Brian Mattis
Lovelace Soirez
Catherine Bullock
Dave Martini
Sara Jensen
James Levy
Adam Jones
Published in:
3DIC (2016)
Keyphrases
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high density
mid level
thin film
low level
low density
high level
low level features
event detection
visual cues
action recognition
perceptual grouping
levels of abstraction
superpixels
visual information
data center
visual concepts
multi modal
video sequences