Development of high accuracy wafer thinning and pickup technology for thin wafer.
Chuichi MiyazakiHaruo ShimamotoToshihide UematsuYoshiyuki AbeKosuke KitaichiTadahiro MorifujiShoji YasunagaPublished in: 3DIC (2010)
Keyphrases
- high accuracy
- integrated circuit
- rapid development
- semiconductor manufacturing
- st century
- information society
- case study
- software engineering
- computer systems
- development process
- massively parallel
- technical issues
- support systems
- future development
- information processing
- technical aspects
- preprocessing
- current status
- future trends
- core components
- computational science
- participatory design
- financial services
- assistive technology
- simulated annealing
- mobile technologies
- management information systems
- emerging technologies
- key technologies
- high efficiency
- genetic algorithm
- communication technologies