Login / Signup
Efficient Thermal Simulation for 3-D IC With Thermal Through-Silicon Vias.
Dongkeun Oh
Charlie Chung-Ping Chen
Yu Hen Hu
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2012)
Keyphrases
</>
integrated circuit
infrared
high density
low cost
heat transfer
neural network
computationally efficient
power plant
high temperature
database
real time
lightweight
mathematical model
numerical simulations
air temperature