Login / Signup
Pre-bond testing of die logic and TSVs in high performance 3D-SICs.
Brandon Noia
Krishnendu Chakrabarty
Published in:
3DIC (2011)
Keyphrases
</>
formal theory
asynchronous circuits
multi valued
low cost
test cases
expressive power
test data
modal logic
probabilistic logic
classical logic
automated reasoning
high reliability
computational properties
logical framework
data sets
high efficiency
information systems
neural network