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Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure.

Raj Sekar SethuHong Seng NgAlvin ChanCheng Nee OngSieng Fong Chan
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • thin film
  • high density
  • plasma etching
  • multi layer
  • chemical vapor deposition
  • data sets
  • neural network
  • database
  • computer vision
  • control system
  • printed circuit boards
  • silicon nitride