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Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era.
Ammar Karkar
Nizar Dahir
Terrence S. T. Mak
Kin-Fai Tong
Published in:
ACM J. Emerg. Technol. Comput. Syst. (2022)
Keyphrases
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low cost
high speed
high density
complex systems
communication channels
real time
three dimensional
d objects
communication systems
communication protocol
wave propagation