Damage evaluation of wet-chemical silicon-wafer thinning process.

Naoya Watanabe Takumi Miyazaki Masahiro Aoyagi Kazuhiro Yoshikawa

Published in: 3DIC (2011)

Keyphrases

evaluation process
process model
genetic algorithm
learning algorithm
knowledge base
edge detection
evaluation methods
database
databases
neural network
data mining
image segmentation
high density