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Reliability considerations for ESD protection under wire bonding pads.

Warren R. AndersonWilliam M. GonzalezSheera S. KnechtWendy Fowler
Published in: Microelectron. Reliab. (2001)
Keyphrases
  • wire bonding
  • stress response
  • real time
  • reliability analysis
  • information security
  • protection scheme
  • database
  • genetic algorithm
  • case study
  • optimization problems
  • privacy protection
  • failure rate
  • highly reliable