Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.
Tomi LaurilaToni T. MattilaVesa VuorinenJuha KarppinenJue LiMika SippolaJorma K. KivilahtiPublished in: Microelectron. Reliab. (2007)
Keyphrases
- mechanical properties
- failure rate
- high temperature
- composite materials
- thermal conductivity
- electrical power
- power consumption
- printed circuit boards
- selection mechanism
- learning mechanism
- artificial intelligence
- learning algorithm
- genetic algorithm
- power plant
- data center
- mathematical model
- infrared
- social networks