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Compact InP MZM Optical Sub-Assembly with Built-in Electrical Filters by Three-Dimensional Packaging Technique.
Fukiko Hirose
Keita Mochizuki
Junichi Suzuki
Shusaku Hayashi
Yosuke Suzuki
Kiyotomo Hasegawa
Published in:
OECC/PSC (2019)
Keyphrases
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printed circuit boards
three dimensional
physical characteristics
high speed
x ray
high density
surface reconstruction
integrated circuit
digital holography
virtual reality
human body
multi view
depth map
design process
edge enhancement
assembly process
image processing