Coupling capacitance extraction in through-silicon via (TSV) arrays.

Tarek Ramadan Eslam Yahya Mohamed Dessouky Yehea I. Ismail

Published in: ICECS (2015)

Keyphrases

high speed
information extraction
low cost
low power
high density
infrared
automatic extraction
focal plane
learning algorithm
knowledge base
image processing
website
automatically extracted
silicon dioxide