Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation.
K. S. KaurAnanth Z. SubramanianRik VerplanckeP. CardileJoris Van KerrebrouckSilvia SpigaR. MeyerJohan BauwelinckRoel BaetsGeert Van SteenbergePublished in: ECOC (2015)
Keyphrases
- high speed
- cmos technology
- silicon on insulator
- low power
- ibm power processor
- metal oxide semiconductor
- parallel processing
- high density
- low voltage
- power consumption
- radio frequency
- low cost
- intraoperative
- image sensor
- laser beam
- power dissipation
- cmos image sensor
- neural network
- laser scanner
- fiber optic
- single chip
- real time
- ultra low power
- laser radar
- image acquisition
- steady state
- three dimensional