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Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening.

Yong GuanQinghua ZengJing ChenShenglin MaYufeng Jin
Published in: NEMS (2016)
Keyphrases
  • integrated circuit
  • application layer
  • data integration
  • coarse to fine
  • image processing
  • high speed
  • high density
  • electron beam
  • information retrieval
  • information systems
  • knowledge base
  • multi layer
  • high voltage