Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect.

Arthur Nieuwoudt Mosin Mondal Yehia Massoud

Published in: ASP-DAC (2007)

Keyphrases

high speed
power dissipation
low cost
carbon nanotubes
high density
single chip
power consumption
analog vlsi
solid models
failure rate
real time
carbon dioxide
programmable logic
physical design
vlsi implementation
reliability analysis
input output
image processing