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Packaging Technology for Electronic Applications in Harsh High-Temperature Environments.
Ping Hagler
Phillip Henson
R. Wayne Johnson
Published in:
IEEE Trans. Ind. Electron. (2011)
Keyphrases
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high temperature
data processing
real world
personal computer
real time
neural network
case study
artificial intelligence
fuzzy sets
dynamic environments
input output
cost effective
rapid development
high density
technological advances