Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack.

Keiji Matsumoto Hiroyuki Mori Yasumitsu Orii

Published in: 3DIC (2014)

Keyphrases

three dimensional
low cost
high speed
x ray
analog vlsi
neural network
high density
simulated annealing
range images
surface reconstruction
d objects
circuit design
magnetic recording
multi view
depth map
low power
single chip
vlsi implementation
vlsi design
real time