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Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging.
Takashi Matsumae
Shingo Kariya
Yuichi Kurashima
Le Hac Huong Thu
Eiji Higurashi
Masanori Hayase
Hideki Takagi
Published in:
Sensors (2022)
Keyphrases
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room temperature
wire bonding
high density
scale space
integrated circuit
data sets
high speed
small scale
facial expression recognition
multi layer
thin film
semiconductor manufacturing
database
information systems
multiple layers
thermal conductivity