Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN).

Eric Beyne Anne Jourdain Gerald Beyer

Published in: VLSI Technology and Circuits (2023)

Keyphrases

high density
high bandwidth
social networks
low cost
complex networks
packet switched
real time
high speed
power consumption
network analysis
network design
network model
heterogeneous networks
nano scale
power distribution networks