Filling through-silicon vias with conductive ferromagnetic silver-iron composite.

Chung-Han Lu Kerwin Wang

Published in: NEMS (2014)

Keyphrases

magnetic field
high density
integrated circuit
low cost
data center
gallium arsenide
electron microscopy
neural network
multiscale
high speed
image sequences
decision trees
data mining
texture synthesis
thin film
transmission line
steel industry
data sets