Login / Signup
Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading.
Hisashi Tanie
Kazuhiko Nakane
Yusuke Urata
Masatoshi Tsuda
Nobutada Ohno
Published in:
Microelectron. Reliab. (2011)
Keyphrases
</>
mechanical properties
high temperature
infrared
finite element model
social networks
wireless sensor networks
digital images
data sets
face recognition
power plant
printed circuit boards
finite element analysis
electron microscopy
view angle
electrical properties