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Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds.
Daniel T. Rooney
DeePak Nager
David Geiger
Dongkai Shanguan
Published in:
Microelectron. Reliab. (2005)
Keyphrases
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wire bonding
bond pad
evaluation process
process model
data sets
low cost
image analysis
sufficient conditions
numerical simulations
process control
stress response