Daniel T. Rooney

Publication Activity (10 Years)

Years Active: 2004-2007
Publications (10 Years): 0

Publications

Daniel T. Rooney, Louis Gullo, Dongji Xie, N. Todd Castello, Dongkai Shanguan
Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules. Microelectron. Reliab. 47 (12) (2007)
Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectron. Reliab. 45 (2) (2005)
Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie
Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectron. Reliab. 44 (2) (2004)