DeePak Nager

Publication Activity (10 Years)

Years Active: 2005-2005
Publications (10 Years): 0

Publications

Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectron. Reliab. 45 (2) (2005)