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Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages.
Yuelin Wu
K. N. Subramanian
Scott Calabrese Barton
Andre Lee
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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mechanical properties
electron microscopy
empirical studies
room temperature
human behavior
stainless steel
complex systems
behavior patterns
wire bonding
neural network
website
case study
particle swarm optimization
optimization algorithm
deeper understanding
finite element model