K. N. Subramanian

Publication Activity (10 Years)

Years Active: 2007-2017
Publications (10 Years): 1

Top Topics

Mechanical Properties

Behavior Patterns

Top Venues

Microelectron. Reliab.

Publications

Yuelin Wu, K. N. Subramanian, Scott Calabrese Barton, Andre Lee
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages. Microelectron. Reliab. 78 (2017)
J. G. Lee, K. N. Subramanian
Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. Microelectron. Reliab. 47 (1) (2007)