Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection.
Jinjin LiBonnie L. BennettLina J. KaramJeffrey S. PettinatoPublished in: IEEE Trans Autom. Sci. Eng. (2016)
Keyphrases
- computer vision
- vision system
- semiconductor devices
- printed circuit boards
- real time
- semi automated
- stereo vision
- three dimensional
- omni directional
- straight line
- stereo images
- fully automated
- multi camera
- stereo camera
- mechanical properties
- conformal geometric algebra
- high temperature
- stereo pair
- quality control
- disparity map
- image pairs
- depth map
- human computer interaction
- ground truth