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Modeling and Evaluation of the Interconnection-driven Repairability for Distributed Embedded Memory Cores on Chip.
B. Jang
Nohpill Park
K. M. George
George E. Hedrick
Published in:
Modelling, Identification and Control (2003)
Keyphrases
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dynamic random access memory
level parallelism
high density
processor core
distributed environment
distributed systems
high speed
data driven
cooperative
memory subsystem
memory requirements
data transfer
multi agent
mobile agents
real time
low cost
real time embedded