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Impact of floorplanning and thermal vias placement on temperature in 2D and 3D processors.
Piotr Zajac
Melvin Galicia
Cezary Maj
Andrzej Napieralski
Published in:
Microelectron. J. (2016)
Keyphrases
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high temperature
thermal imaging
heat transfer
room temperature
infrared
thermal conductivity
high density
air temperature
power plant
parallel computation
integrated circuit
finite element analysis
air conditioning
high impact
parallel computing
parallel processing
power system