8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology.
Uksong KangHoeju ChungSeongmoo HeoDukha ParkHoon LeeJin Ho KimSoon-Hong AhnSooho ChaJaesung AhnDukmin KwonJaewook LeeHan-Sung JooWoo-Seop KimDong Hyeon JangNam-Seog KimJung-Hwan ChoiTae-Gyeong ChungJei-Hwan YooJoo-Sun ChoiChanghyun KimYoung-Hyun JunPublished in: IEEE J. Solid State Circuits (2010)