Thermal Parameter Monitoring of IGBT Module Using Junction Temperature Cooling Curves.
Jun ZhangXiong DuYaoyi YuShuai ZhengPengju SunHeng-Ming TaiPublished in: IEEE Trans. Ind. Electron. (2019)
Keyphrases
- heat transfer
- electrical power
- thermal conductivity
- thermal imaging
- numerical simulations
- high temperature
- monitoring system
- room temperature
- real time
- air temperature
- b spline
- power system
- input parameters
- health monitoring
- mathematical models
- transmission line
- power supply
- simulation software
- infrared
- air conditioning
- parameter values
- planar curves
- situation assessment
- solar radiation
- gallium arsenide
- finite element
- data acquisition
- decision support
- decision support system
- multiscale
- neural network