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Performance impact of through-silicon vias (TSVs) in three-dimensional technology measured by SRAM ring oscillators.
Jente B. Kuang
Keith A. Jenkins
Kevin Stawiasz
Jeremy D. Schaub
Published in:
ESSCIRC (2013)
Keyphrases
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three dimensional
high density
cmos technology
case study
low cost
rapid development
internet enabled
solar cell
power consumption
integrated circuit
key technologies
virtual reality
information systems
cost effective
x ray
thin film
computer systems
high speed
d objects
gallium arsenide