Fabrication of TSV-based silicon interposers.

Dean Malta Erik Vick Scott H. Goodwin Christopher Gregory Matthew Lueck Alan Huffman Dorota Temple

Published in: 3DIC (2010)

Keyphrases

high density
plasma etching
semiconductor devices
high speed
low density
silicon on insulator
data center
thin film
integrated circuit
chemical vapor deposition
field effect transistors
magnetic recording
three dimensional
artificial intelligence
cloud computing
liquid crystal
image processing
computer vision