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A novel simulation methodology for full chip-package thermo-mechanical reliability investigations.
Balamurugan Karunamurthy
Thomas Ostermann
Monojit Bhattacharya
Sandipan Maity
Published in:
Microelectron. J. (2014)
Keyphrases
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high density
discrete event simulation
reliability assessment
simulation models
design methodology
case study
data sets
analog vlsi
simulation model
mathematical models
chip design
reliability analysis
high bandwidth
physical design
finite element model
simulation environment
simulation study
high speed
low cost