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Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits.
Dennis Rich
Anna Kasperovich
Mohamadali Malakoutian
Robert M. Radway
Shiho Hagiwara
Takahide Yoshikawa
Srabanti Chowdhury
Subhasish Mitra
Published in:
DAC (2023)
Keyphrases
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integrated circuit
infrared
high speed
collaborative learning
stereo correspondence
power plant
learning environment
solder ball connect
low cost
printed circuit boards
finite element analysis
visible spectrum
high temperature
online collaborative learning
neural network
thermal images