Thermal-aware optical-electrical routing codesign for on-chip signal communications.
Yu-Sheng LuKuan-Cheng ChenYu-Ling HsuYao-Wen ChangPublished in: DAC (2022)
Keyphrases
- printed circuit boards
- physical characteristics
- electrical properties
- signal processing
- injection lasers
- infrared
- high speed
- electro optic
- focal plane
- packet switching
- high frequency
- low cost
- charge coupled device
- switched networks
- routing algorithm
- image sensor
- communication systems
- integrated circuit
- wavelength division multiplexing
- communication networks
- interconnection networks
- routing protocol
- shortest path
- network topology
- electrical power
- chip design
- analog vlsi
- fiber optic
- sigma delta
- equivalent circuit
- hw sw
- solid state
- steady state
- ad hoc networks