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High-Density 4T SRAM Bitcell in 14-nm 3-D CoolCube Technology Exploiting Assist Techniques.

Reda BoumcheddaJean-Philippe NoelBastien GiraudKaya Can AkyelMelanie BrocardDavid TurgisEdith Beigné
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2017)
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