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Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments.
Jie Wu
Songbai Xue
Jingwen Wang
Jianxin Wang
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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comparative study
mechanical properties
electron microscopy
thin film
highly reliable
failure rate
artificial intelligence
dynamic environments
genetic algorithm
information systems
e learning
case study
wireless sensor networks
ambient intelligence
reliability analysis