Splash suppression during wafer wet cleaning through drop penetration across metal meshes and porous fiber mats.
Chan-Woo ParkTae-Gun KimMin-Woo KimAli AldalbahiMohamed El-NewehySam S. YoonPublished in: J. Vis. (2020)
Keyphrases
- multiresolution
- semiconductor manufacturing
- integrated circuit
- d mesh
- optical fiber
- fiber optic
- massively parallel
- micro aggregation
- star shaped
- mesh generation
- grain size
- variable resolution
- data cleaning
- high temperature
- edge detection
- volumetric images
- myelinated nerve
- power distribution
- neural network
- diffusion tensor imaging
- diffusion tensor
- triangular mesh
- white matter
- data integration