Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads.
Klaus FellnerThomas AntretterPeter F. FuchsQi TaoPublished in: Microelectron. Reliab. (2016)
Keyphrases
- printed circuit boards
- numerical simulations
- heat transfer
- theoretical analysis
- visual inspection
- integrated circuit
- dynamic response
- manufacturing process
- finite element method
- lattice boltzmann
- temperature field
- finite element analysis
- computational fluid dynamics
- real time
- finite element model
- power plant
- electrical properties
- vision system
- numerical calculation