Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits.
Peng XuHuan HuangBing-Qi ZhangZheng-Hua TangPublished in: IEEE Access (2023)
Keyphrases
- integrated circuit
- three dimensional
- thermal conductivity
- infrared
- composite materials
- d objects
- virtual reality
- range images
- power plant
- learning materials
- x ray
- surface reconstruction
- multi view
- image sequences
- visible spectrum
- electron beam
- mechanical properties
- room temperature
- materials science
- human body
- carbon nanotubes