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Thermal placement on PCB of components including 3D ICs.
Yuuta Satomi
Koutaro Hachiya
Toshiki Kanamoto
Ryosuke Watanabe
Atsushi Kurokawa
Published in:
IEICE Electron. Express (2020)
Keyphrases
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printed circuit boards
case study
building blocks
computer vision
infrared
information retrieval
information systems
software components
assembly process