Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors.
Hai WangSheldon X.-D. TanDuo LiAshish GuptaYuan YuanPublished in: ACM Trans. Design Autom. Electr. Syst. (2013)
Keyphrases
- infrared
- heat transfer
- management system
- level parallelism
- visible spectrum
- colored petri nets
- power plant
- discrete event simulation
- solder ball connect
- multiagent based simulation
- thermal imaging
- higher level
- computing power
- thermal images
- software architecture
- high temperature
- architectural models
- computer systems
- real time
- application level
- finite element analysis
- simulation models
- instruction set
- hardware software
- simulation model
- multi agent systems