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Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics.

Conrad FerrerOriol Avino-SalvadoMiquel VellvehíXavier JordàXavier Perpiñà
Published in: IEEE Trans. Instrum. Meas. (2023)
Keyphrases
  • fourier series
  • thermal imaging
  • reconstruction method
  • steady state
  • image reconstruction
  • three dimensional
  • computer vision
  • infrared
  • image analysis
  • multiresolution