Login / Signup
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit.
Kosuke Nanbara
Akihiro Odoriba
Masaki Hashizume
Hiroyuki Yotsuyanagi
Shyue-Kung Lu
Published in:
3DIC (2015)
Keyphrases
</>
high speed
electronic circuits
real time
website
expert systems
software development
test cases
chip design