A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on-Si for On-Board Optics.
Toshiki KishiHitoshi WakitaKota ShikamaMunehiko NagataniShigeru KanazawaTakuro FujiiHidetaka NishiHiroshi IshikawaYuko KawajiriAtsushi AratakeHideyuki NosakaHiroshi FukudaShinji MatsuoPublished in: OFC (2019)
Keyphrases
- low power
- image sensor
- high speed
- power consumption
- low cost
- ultra low power
- focal plane
- single chip
- bond pad
- wireless transmission
- high power
- solid state
- digital signal processing
- machine vision
- wire bonding
- low power consumption
- vlsi circuits
- vlsi architecture
- communication systems
- dynamic range
- gate array
- logic circuits
- cmos technology
- imaging systems
- real time
- power reduction
- hardware and software
- stress response
- power supply
- wireless sensor networks