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Insights into device and material origins and physical mechanisms behind cross temperature in 3D NAND.

Milan PesicBastien BeltrandoTommaso RolloCristian ZambelliAndrea PadovaniRino MicheloniRita MajiLisa EnmanMark SalyYang Ho BaeJung Bae KimDong Kil YimLuca Larcher
Published in: IRPS (2023)
Keyphrases
  • physical world
  • computational tools
  • data mining
  • real time
  • multi agent systems
  • mechanical properties
  • portable devices