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Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump.
Nobuaki Miyakawa
Eiri Hashimoto
Takanori Maebashi
Natsuo Nakamura
Yutaka Sacho
Shigeto Nakayama
Shinjiro Toyoda
Published in:
CICC (2008)
Keyphrases
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cost effective
technological advances
real time
case study
data processing
rapid development
combining multiple
feature selection
decision making
computer science
key technologies
electron beam
semiconductor manufacturing