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Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process.
Chun-Fu Lin
Hong-Ren Fang
Jyh-Rou Sze
Sheng-Fuu Lin
Chi-Hung Hwang
Published in:
I2MTC (2016)
Keyphrases
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data acquisition
integrated circuit
real time
low cost
printed circuit boards
high speed
monitoring system
image analysis
data collection
data analysis
data processing
high resolution
surface defects
electron beam
manufacturing process
image processing algorithms
vision system
data mining