Development of wafer thinning and dicing technology for thin wafer.
Chuichi MiyazakiHaruo ShimamotoToshihide UematsuYoshiyuki AbePublished in: 3DIC (2009)
Keyphrases
- semiconductor manufacturing
- rapid development
- st century
- case study
- integrated circuit
- massively parallel
- cost effective
- information society
- participatory design
- software engineering
- key technologies
- medial axis
- management information systems
- communication technologies
- assistive technology
- manufacturing process
- support systems
- nsf funded
- development process
- decision support
- computational science
- innovative ways
- computer network security
- technological advances
- data processing
- control system
- preprocessing